cystech electronics corp. spec. no. : c316l3 issued date : 2010.12.29 revised date : 2011.01.03 page no. : 1/7 BTC2881L3 cystek product specification general purpose npn epitaxial planar transistor BTC2881L3 bv ceo 200v i c 1a r cesat(max) 0.86 features ? high breakdown voltage, bv ceo 200v ? large continuous collector current capability ? low collector saturation voltage ? pb-free lead plating and halogen-free package symbol outline absolute maximum ratings (ta=25 c) parameter BTC2881L3 sot-223 b base b c e c collector e emitter symbol limits unit collector-base voltage v cbo 300 v collector-emitter voltage v ceo 200 v emitter-base voltage v ebo 6 v collector current i c 1 a base current i b 0.2 a power dissipation @t a =25 1 w power dissipation @t c =25 p d 6 w operating junction and storage te mperature range tj ; tstg 150 c ordering information device package shipping BTC2881L3 sot-223 2500 pcs / tape & reel (pb-free lead plating an d halogen-free package)
cystech electronics corp. spec. no. : c316l3 issued date : 2010.12.29 revised date : 2011.01.03 page no. : 2/7 BTC2881L3 cystek product specification thermal data parameter symbol value unit thermal resistance, junction-to-ambient, max r th,j-a 125 c/w thermal resistance, junction-to-case, max r th,j-c 20.8 c/w characteristics (ta=25 c) symbol min. typ. max. unit test conditions bv cbo 300 - - v i c =100 a bv ceo 200 - - v i c =1ma bv ebo 6 - - v i e =10 a i cbo - - 100 na v cb =300v i ebo - - 100 na v eb =6v *v ce(sat) - 0.17 0.4 v i c =500ma, i b =50ma *v ce(sat) - 0.37 0.6 v i c =700ma, i b =35ma *v be(sat) - 0.85 1 v i c =500ma, i b =50ma *v be(on) - 0.81 1 v v ce =5v, i c =500ma *h fe 1 120 - - - v ce =5v, i c =50ma *h fe 2 120 - 320 - v ce =5v, i c =100ma *h fe 3 30 - - - v ce =5v, i c =700ma f t - 120 - mhz v ce =5v, i c =100ma cob - 8 15 pf v cb =10v, i e =0a,f=1mhz *pulse test: pulse width 300 s, duty cycle 2% recommended soldering footprint
cystech electronics corp. spec. no. : c316l3 issued date : 2010.12.29 revised date : 2011.01.03 page no. : 3/7 BTC2881L3 cystek product specification typical characteristics emitter grounded output characteristics 0 0.05 0.1 0.15 0.2 0.25 0123456 collector-to-emitter voltage---vce(v) collector current---ic(a) 200u a 300u a 400u a 500ua 1ma ib=100ua emitter grounded output characteristics 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0123456 collector-to-emitter voltage---vce(v) collector current---ic(a) 1ma 1.5ma 2ma 2.5ma 5ma ib=500ua emitter grounded output characteristics 0 0.2 0.4 0.6 0.8 1 0123456 collector-to-emitter voltage---vce(v) collector current---ic(a) ib=2ma 4ma 6ma 8ma 10ma 20m a emitter grounded output characteristics 0 0.2 0.4 0.6 0.8 1 1.2 012345 collector-to-emitter voltage---vce(v) collector current---ic(a) ib=5ma 10ma 15ma 20ma 50ma current gain vs collector current 10 100 1000 1 10 100 1000 collector current---ic(ma) current gain---hfe vce=1v vce=2v vce=10v saturation voltage vs collector current 10 100 1000 1 10 100 1000 collector current---ic(ma) saturation voltage---(mv) ic=10ib vcesat=20ib
cystech electronics corp. spec. no. : c316l3 issued date : 2010.12.29 revised date : 2011.01.03 page no. : 4/7 BTC2881L3 cystek product specification typical characteristics(cont.) saturation voltage vs collector current 100 1000 10000 1 10 100 1000 collector current---ic(ma) saturation voltage---(mv) vbesat@ic=10ib on voltage vs collector current 100 1000 10000 1 10 100 1000 collector current---ic(ma) on voltage---(mv) vce=5v vce=2v transition frequency vs collector current 10 100 1000 1 10 100 1000 collector current---ic(ma) transition frequency---ft(mhz) vce=5v typical capacitance characteristics 1 10 100 1000 0.1 1 10 100 reverse-biased voltage---(v) capacitance---(pf) cib cob ft=1mhz power derating curve 0 0.2 0.4 0.6 0.8 1 1.2 0 50 100 150 200 ambient temperature---ta() power dissipation---pd(w) power derating curve 0 1 2 3 4 5 6 7 0 50 100 150 200 case temperature---tc() power dissipation---pd(w)
cystech electronics corp. spec. no. : c316l3 issued date : 2010.12.29 revised date : 2011.01.03 page no. : 5/7 BTC2881L3 cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c316l3 issued date : 2010.12.29 revised date : 2011.01.03 page no. : 6/7 BTC2881L3 cystek product specification recommended wave soldering condition soldering time product peak temperature pb-free devices 5 +1/-1 seconds 260 +0/-5 c recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 217 c 60-150 seconds 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c316l3 issued date : 2010.12.29 revised date : 2011.01.03 page no. : 7/7 BTC2881L3 cystek product specification sot-223 dimension *: typical inches millimeters 321 f b a c d e g h a1 a2 i style: pin 1.base 2.collector 3.emitter marking: 3-lead sot-223 plastic surface mounted package cystek package code: l3 date code device name c2881 inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.1142 0.1220 2.90 3.10 g 0.0551 0.0709 1.40 1.80 b 0.2638 0.2874 6.70 7.30 h 0.0098 0.0138 0.25 0.35 c 0.1299 0.1457 3.30 3.70 i 0.0008 0.0039 0.02 0.10 d 0.0236 0.0315 0.60 0.80 a1 *13p o - *13 o - e *0.0906 - *2.30 - a2 0 o 10 o 0 o 10 o f 0.2480 0.2638 6.30 6.70 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead: pure tin plated ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0 important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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